The trend of smartphone camera usage is still accelerating, especially with the innovative use of 3D cameras, which will provide gains for the field of smartphone cameras. The trend of 3D cameras is approaching, and high-end smartphones are bound to become standard equipment. The 3D camera is equipped with 3D sensing, modeling, structure light, and TOF software algorithms.
Real time 3D depth&capture
3D camera technology in mobile phone hardware structure light&TOF, equipped with software algorithms to achieve obstacle avoidance, provides an infrared obstacle avoidance solution based on TOF technology, and a single chip can accurately measure distance, construct 3D graphics, and recognize gestures. Long distance, high accuracy, and low latency. The difference in detection distance and accuracy detection speed between 3D camera structure light and TOF is not significant. The difference lies in the fact that the structure light scheme has mature technology and can achieve relatively high depth image resolution. However, it is easily affected by lighting and cannot be used in outdoor environments; The TOF scheme has good anti-interference performance and a wider viewing angle, but its disadvantage is that the depth image resolution is lower.
TOF
Time ON Fly, which calculates the distance to an object based on the flight time of infrared light in the air. TOF ranging has a long distance and high accuracy, which has great advantages over ultrasonic ranging. At the same time, TOF chips with multi-point sensing, such as 8 * 8=64 point sensing and more accurate 240 * 320=76800, can achieve the construction of 3D models of objects. They have a wide range of applications, such as scanning room contours, constructing floor maps, and recognizing gestures, which are more flexible than commonly used gesture recognition ICs for intelligent recognition of up, down, left, right, front, and back.
TOF ranging principle
Calculate the distance to an object based on the flight time of infrared light in the air.
Structure light
Structure light is an optical scheme for 3D scanning that projects a set of mathematically constructed light patterns that illuminate the object being measured in a certain order. A distance to the projector and a known camera synchronously capture an image of a set of illuminated objects. Compared to the planar reference surface used for calibration, the image seen by the camera is distorted by the surface shape of the scanned object. The principle of set triangulation is to calculate the XYZ coordinates of each point on the surface of the scanned object. Then, the obtained point cloud data is used for the calculation and construction of a detailed 3D model of the scanned object surface.
Principle of Struture Light
A 3D scanning optical method that projects a set of mathematically constructed light patterns that illuminate the object being measured in a certain order.
Nowadays, the homogenization of mobile phones is severe, and most can only engage in micro innovation. The camera module is the core component in mobile phones. Therefore, it has become a common breakthrough point for major brands. According to statistics, in 2017, the flagship phones released by major mobile phone manufacturers all focused on photography. The camera shows a lot of pressure! But as expected, 3D cameras have arrived. To comprehensively and deeply strengthen communication and cooperation in the field of intelligent terminal 3D cameras, gather innovative resources more vigorously, accelerate the construction of intelligent terminal industry clusters, further consolidate the foundation of camera resource sharing, and create a favorable development environment and atmosphere. The 3D Camera Summit Forum was held in Shenzhen on May 11, 2017.
Activity 1: "3D Camera" Summit Forum
sponsorShenzhen Camera Industry Association
Undertaking Unit:Mobile newspaper online
Address:Shenzhen Star River Ritz Carlton Hotel
Number of attendees:800 people
Time:May 11, 2017
Supporting units:
Shenzhen Tengsheng Industrial Equipment Co., Ltd
Zhuhai Guanghaojie Precision Machinery Co., Ltd
Shenzhen Chuanhetian Optoelectronics Co., Ltd
Shenzhen Songmao Technology Co., Ltd
Huizhou Xingjuyu Optics Co., Ltd
Nanjing Huajie Aimi Software Technology Co., Ltd
Beijing Weidong Technology Co., Ltd
Zhuhai Kedi Electronic Technology Co., Ltd
Hefei Zhongka Information Technology Co., Ltd
Proposed inviting unit:Huawei OPPO、VIVO、 Xiaomi, Gionee, ZTE, Nubia, Lenovo, Coolpad TCL、 Qualcomm MTK、ST、 Obi Zhongguang TI、SoftKinetic、inter、 Microsoft, Infineon, Alpha, LeEco, Meizu, 360, Meitu, Xiaochili, OnePlus, Hisense, Konka HTC、 Honor, Watward, Yijing, Zetai, Wentai, Huaqin, Tianlong, Haipai, Yude, Taiwan Dali, Xuye, Gekewei, Sibike, Sony, Duowei, Spreadtrum, Hongruan, Shunyu, OFILM, Qiutiwei, Xinli, Shengtai Imaging, Sanyingxing, Foxconn, Guangbao, Wangjing Optoelectronics, Kanto Chenmei, Helitai, BYD, Dongju, Xinli, Kailong, Bilu, New Thinking, Shizun, Guanghaojie, Dazu Laser, Qunguang, Sanglaishi, Zhongxin Jiechuang, Sanmeda and many other well-known enterprises and investment institutions.
Event Highlights:
Highlight 1: The event gathered globally renowned algorithm companies
Highlight 2: Expected 800 attendees for the event
Highlight 3: Comprehensive explanation of the technical difficulties and development trends of 3D cameras from software algorithms to hardware
Forum schedule:
