Product IntroductionThe top separated exclusive transparent structure can quickly dissipate the working heat of the chip, eliminate problems such as test drift and device burnout caused by heat accumulation, and adapt to high heating power chip testing to quickly troubleshoot abnormal faults such as bulges, erosion, and displacement.
Material and process:Support external temperature probes and heat dissipation devices to meet the needs of temperature control testing and thermal performance testing. Retain precise alignment and compression structure, balancing heat dissipation performance and testing accuracy
Applicable EnvironmentSuitable for high and low temperature cycling testing, load testing, and R&D observation scenarios for power chips and high-frequency chips.
Product Features:Transparent heat dissipation, visual observation, expandable, anti overheating drift
service life:5w-10w
Equipment parameters:Current: 10A, frequency 20GHz
