Product IntroductionThe conductive adhesive test seat uses high elasticity anisotropic conductive adhesive instead of traditional spring probes to achieve vertical conductivity, horizontal insulation, and soft contact compression, effectively avoiding chip pin crushing, tin dropping, and deformation. It is suitable for electrical, functional, and aging testing of ultra-thin, fragile, and fine pitch chips.
Material and process:High elasticity anisotropic conductive adhesive
Applicable environment:Widely used for semiconductor, automotive electronics, consumer electronics chip verification and mass production screening
Product Features:Soft contact non-destructive testing, protecting the chip body, compatible with fine spacing, suitable for microchips.
service life:5w-10w
Equipment parameters:Current: 10A, frequency: 20GHz
